车载设备用 多层基板材料「HIPER」系列

Multi-layer Circuit Board Materials for Automotive Components“HIPER”series

HIPER series

Lineup of multi-layer circuit board materials with excellent high heat resistance and high reliability.

Line-up

Line-up

General properties

Item Test method Condition Unit
Halogen-free
MEGTRON 2

R-1577
HIPER V
R-1755V
HIPER D
R-1755D
HIPER M
R-1755M
HIPER E
R-1755E
Halogen-free
R-1566
Conventional
FR-4
R-1766
Glass transition temp (Tg)
DSC
A
°C
170
173
163
153
133
148
140
Thermal decomposition temp (Td)
TG/DTA
A
°C
380
350
345
355
370
350
315
CTE x-axis
α1
IPC TM-650 2.4.41
A
ppm/°C
14-16
11-13
10-12
11-13
11-13
11-13
11-13
CTE y-axis
14-16
13-15
12-14
13-15
13-15
13-15
13-15
CTE z-axis
α1
IPC TM-650 2.4.24
A
34
44
43
40
42
40
65
α2
200
255
236
240
250
180
270
T288 (with copper)
IPC TM-650 2.4.24.1
A
min
25
20
15
18
25
3
1
Dielectric constant (Dk)
1GHz
IPC TM-650 2.5.5.9
C-24/23/50
4.1
4.4
4.4
4.6
4.6
4.6
4.3
Dissipation factor (Df)
0.010
0.016
0.016
0.014
0.013
0.010
0.016
Water absorption
IPC TM-650 2.6.2.1
D-24/23
%
0.14
0.12
0.11
0.11
0.11
0.14
0.14
Flexural modulus
Fill
JIS C6481
A
GPa
23
22
21
22
22
22
21
Peel strength
1oz
IPC TM-650 2.4.8
A
kN/m
1.3
1.5
1.3
1.5
1.6
1.8
2.0

The sample thickness is 0.8mm.

The above data is actual values and not guaranteed values.