加入内层电路的多层基板材料「PreMulti」

加入内层电路的多层基板材料「PreMulti」

一张照片:加入内层电路的多层基板材料「PreMulti」
  • Reduces the load of customers' circuit formation. Contribute to the impedance matching and crosstalk prevention by increasing flexibility of board design.
  • Possible to be high multi-layered up to 24 layers.
  • Quick delivery from order to shipment.
  • Circuit Board Materials

  • Part Number
  • Application
  • Detailed use
  • Automotive
    Mobile
    ・Automotive
    ・Mobile
    Automotive component, Mobile product(PC and related equipment, Mobile phone, Laptop etc.), Amusement machine, Digital appliance, Measuring instrument, Semiconductor test equipment, Semiconductor memory board, etc.

    Properties

    High multi-layered
    ~24 layers
    AOI inspection for
    all materials
    Quick delivery

    What's Mass laminations?

    What's Mass laminations?

    Line-up

    Product Number
    Comment
    C-1810
    Glass epoxy resin shield board used R-1766 material
    C-1510
    Halogen-free shield board used R-1566 material
    C-1850D
    High heat resistance shield board for Automotive component used R-1755D material
    C-1850E
    Shield board for Automotive component used R-1755E material
    C-1850S
    High heat resistance shield board for ICT infrastructure equipment used R-1755S material

    Specification list

    Item
    General Specifications
    Board thickness(Max)
    2.40mm±10%
    Board thickness(Min)
    0.24mm±10%
    Dimensional tolerance between the reference mark
    ±0.15mm
    Accuracy of the layer reach
    0.15mm or less
    Warpage
    1% or less of the long side
    Line/Space
    Copper thickness 12μm: 50/50μm
    Copper thickness 18μm: 50/50μm
    Copper thickness 35μm: 75/75μm
    Copper thickness 70μm: 100/100μm
    Copper thickness 105μm: 150/150μm

    ※The above data is general specifications. Please contact us for more specifications.

    The above data is actual values and not guaranteed values.

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