移动设备用 高流动性LCP树脂成型材料

High fluidity LCP resin Molding Compound for Mobile Products

  • MBL540V MBL240V
  • For mobile products

    Connector, Electronic components

    Achieving high fluidity and heat resistance at narrow gate

    Achieving high fluidity and heat resistance at narrow gate

    Measurement of (maximum) tensile strength of portion having weld line

    Measurement of (maximum) tensile strength of portion having weld line

    Warpage reduction comparison

    Warpage reduction comparison

    General properties

    Evaluation using test piece having connector shape
    For narrow-pitch connector
    Wide use connector
    MBL540V
    MBL240V
    Our prototype
    Weld strength
    High strength
    Conventional LCP
    Bending strength
    Molding compound A
    N
    22
    23
    18
    Amount of bending deflection
    Molding compound A
    mm
    0.80
    0.75
    0.43
    Flexural modulus
    Molding compound A
    GPa
    15
    18
    20
    Tensile strength of the welding part
    Molding compound A
    N
    36
    34
    17
    Warpage
    Molding compound B
    mm
    0.068
    0.071
    0.130
    Warpage
    (After 270°C reflow×3times)
    Molding compound B
    mm
    0.075
    0.082
    0.143
    Fluidity(Injection flow)
    Molding compound B
    mm
    52
    55
    45

    The above data is actual values and not guaranteed values.